JPH043501Y2 - - Google Patents
Info
- Publication number
- JPH043501Y2 JPH043501Y2 JP1364386U JP1364386U JPH043501Y2 JP H043501 Y2 JPH043501 Y2 JP H043501Y2 JP 1364386 U JP1364386 U JP 1364386U JP 1364386 U JP1364386 U JP 1364386U JP H043501 Y2 JPH043501 Y2 JP H043501Y2
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor element
- base
- recess
- fixing material
- semiconductor package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 claims description 36
- 239000000463 material Substances 0.000 description 14
- 238000010304 firing Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 239000010931 gold Substances 0.000 description 4
- 239000000919 ceramic Substances 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 230000002950 deficient Effects 0.000 description 2
- 239000012777 electrically insulating material Substances 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 230000001788 irregular Effects 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 230000008646 thermal stress Effects 0.000 description 2
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229910000833 kovar Inorganic materials 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
Landscapes
- Die Bonding (AREA)
- Measuring Fluid Pressure (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1364386U JPH043501Y2 (en]) | 1986-01-31 | 1986-01-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1364386U JPH043501Y2 (en]) | 1986-01-31 | 1986-01-31 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62131444U JPS62131444U (en]) | 1987-08-19 |
| JPH043501Y2 true JPH043501Y2 (en]) | 1992-02-04 |
Family
ID=30802896
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1364386U Expired JPH043501Y2 (en]) | 1986-01-31 | 1986-01-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH043501Y2 (en]) |
-
1986
- 1986-01-31 JP JP1364386U patent/JPH043501Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62131444U (en]) | 1987-08-19 |
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